Capacitive Microphone Tuning of Ultrasonic/Thermosonic Bonders

WL Loofbourrow

doi:10.1520/STP32673S

SYMPOSIA PAPER Published: 01 January 1984

STP32673S

Capacitive Microphone Tuning of Ultrasonic/Thermosonic Bonders

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Scheduling ultrasonic bonders for optimum settings has long been a mystery. As device bond pads get smaller and silicon and gallium arsenide devices get thinner, ultrasonic energy control at the bond interface becomes very critical. The use of a capacitive microphone sound meter to measure the compressional sound waves at the lower tip of a bonding tool has helped to control these critical energy settings. The results of implementing this process on 25 thermosonic bonders has reduced the damage to microwave devices by 30% and decreased the wire bond assembly time 25%.

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Loofbourrow, WL

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Details

Developed by Committee: F01

Pages: 472–484

DOI: 10.1520/STP32673S

ISBN-EB: 978-0-8031-4915-1

ISBN-13: 978-0-8031-0403-7

Capacitive Microphone Tuning of Ultrasonic/Thermosonic Bonders

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