Fracture Tracing in Semiconductor Wafers

LD Dyer

doi:10.1520/STP32660S

SYMPOSIA PAPER Published: 01 January 1984

STP32660S

Fracture Tracing in Semiconductor Wafers

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From the beginning of their shaping until their final assembly into useful devices and systems, semiconductor wafers are subject to several kinds of failure, one of which is brittle fracture. The purpose of this paper is to describe the method of tracing cracks in silicon slices back to their origins and of further analyzing the fracture by means of characteristic fracture markings. Some background material in fracture theory and the causes of various markings is also presented.

Author Information

Dyer, LD

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Details

Developed by Committee: F01

Pages: 297–308

DOI: 10.1520/STP32660S

ISBN-EB: 978-0-8031-4915-1

ISBN-13: 978-0-8031-0403-7

Fracture Tracing in Semiconductor Wafers

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