Standard Specification for Cool-Application Filling Compounds for Telecommunications Wire and Cable

This specification covers two types of cool-application compounds used for filling the air spaces in telecommunications wires and cables (both electrical and fiber optic) for the purpose of preventing water and other undesirable fluids from entering or migrating through the cable structure. Type I are general-purpose filling compounds including all materials to be used for filling cables that are not required to function under electrical stress (for example, all-dielectric fiber-optic cable), including filling compounds for fiber-optic loose buffer tubes. While, Type II are electrical-type filling compounds including materials having prescribed electrical properties and used for filling wires and cables that are required to function fully or partially under electrical stress (including hybrid fiber-optic cable). Though chemical composition is not specified, the filling compounds shall, however, be tested and conform accordingly to the following electrical, physical, and temperature characteristics, as agreed upon between producer and purchaser: dissipation factor; volume resistivity; corrosion inhibition; adhesion; flash point; high-temperature drip/oil separation (syneresis) in the raw material state; evaporation loss; water resistance; homogeneity; color and opacity; color stability; foreign materials; volatility; thermal oxidative stability; cone penetration; pour point; drop-melting point; viscosity; congealing point; drop point; cable drip-out temperature; and cold-bend low-temperature flexibility.