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Last Updated: Dec 31, 2010
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ASTM B734-97(2003)e1
Standard Specification for Electrodeposited Copper for Engineering Uses
Standard Specification for Electrodeposited Copper for Engineering Uses
B0734-97R03E01
ASTM|B0734-97R03E01|en-US
Standard Specification for Electrodeposited Copper for Engineering Uses
Standard
B734 Standard Specification for Electrodeposited Copper for Engineering Uses>
new
BOS Vol. 02.05 Committee B08
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Scope
1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.
1.3 This specification is not intended for electrodeposited copper when used for electroforming.