Prediction of Failures in Service by Photoelastic Methods

S. Redner

doi:10.1520/STP48453S

SYMPOSIA PAPER Published: 01 January 1970

STP48453S

Prediction of Failures in Service by Photoelastic Methods

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The technique of photoelasticity has been used basically as a stress analysis tool. More recently, its application to failure prediction has found extensive application, and it has become a powerful and economical approach in solving the failure analysis problem. Some areas of application are discussed in this article, including defect detection, residual stress measurement, effect of assembly stresses, service overloads, and proof testing.

Author Information

Redner, S.

Photolastic, Inc., a subsidiary of Vishay Intertechnology, Inc., Malvern, Pa.

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Details

Developed by Committee: E08

Pages: 35–45

DOI: 10.1520/STP48453S

ISBN-EB: 978-0-8031-6681-3

ISBN-13: 978-0-8031-6654-7

Prediction of Failures in Service by Photoelastic Methods

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