Dip-Soldered Printed Circuit Joint Characteristics

Alfred Johns; Eugen Miller

doi:10.1520/STP44115S

SYMPOSIA PAPER Published: 01 January 1957

STP44115S

Dip-Soldered Printed Circuit Joint Characteristics

Source

Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints:

1. Efficiency of joint formation.

2. Short-time tensile strength.

3. Impact strength in tension.

4. Creep strength in tension.

Author Information

Johns, Alfred, A.

Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.

Miller, Eugen, S.

Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.

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Details

Developed by Committee: B02

Pages: 115–128

DOI: 10.1520/STP44115S

ISBN-EB: 978-0-8031-5938-9

ISBN-13: 978-0-8031-6092-7

Dip-Soldered Printed Circuit Joint Characteristics

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