Soldering in Semiconductor Devices

W. Lootens

doi:10.1520/STP44107S

SYMPOSIA PAPER Published: 01 January 1957

STP44107S

Soldering in Semiconductor Devices

Source

Semiconductor devices are very sensitive to surface contamination, and soldering flux is like a death warrant to the device. It is possible to do most of the soldering on these devices without flux by using the correct materials, temperature, and atmosphere. Illustrations of examples of how this has been done are shown. Some of the requirements for various applications are given. Certain metals, if used on semiconductor materials, may give trouble even if they occur only as an impurity in the solder. These metals are noted along with the effects they would have.

Author Information

Lootens, W., F.

Rectifier Section, General Electric Co., Syracuse, N. Y.

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Details

Developed by Committee: B02

Pages: 41–48

DOI: 10.1520/STP44107S

ISBN-EB: 978-0-8031-5938-9

ISBN-13: 978-0-8031-6092-7

Soldering in Semiconductor Devices

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