Elevated Temperature Resistant Metal-to-Metal Adiiesives Derived from Organic-Inorganic Polymer Systems

Edward  Janis

doi:10.1520/STP42655S

SYMPOSIA PAPER Published: 01 January 1961

STP42655S

Elevated Temperature Resistant Metal-to-Metal Adiiesives Derived from Organic-Inorganic Polymer Systems

Privent day organic adhesives for elevated temperature resistant metal-to-metal bonded structures are primarily of a phenolic or epoxy modified phenolic nature. Each can produce bonded joints able to withstand short time exposure at temperatures ranging from 500 F to 1000 F and still yield useful structural strength.

Author Information

Janis, Edward, C.

Narmco Industries, Inc., San Diego, Calif.

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Details

Developed by Committee: D14

Pages: 18–36

DOI: 10.1520/STP42655S

ISBN-EB: 978-0-8031-5955-6

ISBN-13: 978-0-8031-6109-2

Elevated Temperature Resistant Metal-to-Metal Adiiesives Derived from Organic-Inorganic Polymer Systems

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