A Phenomenology of Room-Temperature Stress Relaxation in Cold-Rolled Copper Alloys

P Parikh; E Shapiro

doi:10.1520/STP37414S

SYMPOSIA PAPER Published: 01 January 1979

STP37414S

A Phenomenology of Room-Temperature Stress Relaxation in Cold-Rolled Copper Alloys

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Room-temperature tension stress relaxation tests on two copper alloys—CDA 510 and CDA 638—were conducted to determine if structural changes accompany stress relaxation. Changes in relaxation rate and in the shape of the tensile stress-strain curves as a result of stress relaxation were analyzed. The results indicate that structural changes during stress relaxation are brought about by a dislocation rearrangement process akin to recovery. Mobile dislocation density was found to change during testing, and work hardening did not contribute in decreasing the relaxation rate.

Author Information

Parikh, P

Mechanical Metallurgy Group, Olin Metals Research Laboratories, New Haven, Conn.

Shapiro, E

Mechanical Metallurgy Group, Olin Metals Research Laboratories, New Haven, Conn.

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Details

Developed by Committee: E28

Pages: 36–41

DOI: 10.1520/STP37414S

ISBN-EB: 978-0-8031-4745-4

ISBN-13: 978-0-8031-0581-2

A Phenomenology of Room-Temperature Stress Relaxation in Cold-Rolled Copper Alloys

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