Characterizing Process Nonuniformities on Large-Diameter Wafers: An Overview

DS Perloff

doi:10.1520/STP36182S

SYMPOSIA PAPER Published: 01 January 1983

STP36182S

Characterizing Process Nonuniformities on Large-Diameter Wafers: An Overview

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An overview is presented of the techniques available for characterizing process nonuniformities on large-diameter wafers. Examples are given of the use of two-dimensional and three-dimensional mapping techniques for displaying within-wafer variability, and of relative and cumulative frequency plots for representing process tolerances. Two new display methods are recommended for dealing with small data sets: minicontour maps and folded-axis cumulative frequency plots.

Author Information

Perloff, DS

Signetics Corporation, Sunnyvale, Calif. PROMETRIX Corp., Sunnyvale, Calif.

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Details

Developed by Committee: F01

Pages: 422–444

DOI: 10.1520/STP36182S

ISBN-EB: 978-0-8031-4871-0

ISBN-13: 978-0-8031-0243-9

Characterizing Process Nonuniformities on Large-Diameter Wafers: An Overview

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