Lifetime Prediction for Hot-Pressed Silicon Nitride at High Temperatures

T Fett; D Munz

doi:10.1520/STP35243S

SYMPOSIA PAPER Published: 01 January 1984

STP35243S

Lifetime Prediction for Hot-Pressed Silicon Nitride at High Temperatures

Source

Four-point bend specimens of hot-pressed silicon nitride were tested at 1000 and 1200°C at constant displacement rates and with constant applied load. At all temperatures the relationship between failure probability and time to failure could be predicted for the tests with constant load from the test performed at constant displacement rate, using the relations of linear elastic fracture mechanics. Regarding the test at 1200°C, the varying stresses due to creep have to be taken into account in the predictions.

Author Information

Fett, T

Kernforschungszentrum Karlsruhe, Arbeitsgruppe Zuverlässigkeit und Schadenskunde am Institut für Reaktorbauelemente, West Germany

Munz, D

Universität Karlsruhe, Institut für Zuverlässigkeit und Schadenskunde im Maschinenbau, West Germany

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Details

Developed by Committee: E08

Pages: 154–176

DOI: 10.1520/STP35243S

ISBN-EB: 978-0-8031-4910-6

ISBN-13: 978-0-8031-0265-1

Lifetime Prediction for Hot-Pressed Silicon Nitride at High Temperatures

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