Effective determination of adhesively bonded joint durability is crucial for reliable component design and realization of advanced performance. In order to model bond endurance in a manner more consistent with severe service environments, a cyclic stress durability apparatus that achieved constant shear stress without loss due to creep relaxation was designed and implemented for accelerated joint durability analysis of two modified epoxy based structural adhesives. Results were compared with those achieved by sustained stress durability.

Thermal analysis of the bulk adhesives, both before and after hygrothermal exposure, was compared with bonded joint mechanical and durability performance to explore the potential utility of thermal analytical methods in describing adhesive joint properties.

Two cure histories for each adhesive were investigated to establish bonded joint performance and environmental resistance for conventional joint fabrication and potential adhesive/adherend co-curing capabilities.