An Examination of Mixed-Mode Debonding in the Blister Test

KM Liechti; EC Hanson

doi:10.1520/STP30324S

SYMPOSIA PAPER Published: 01 January 1988

STP30324S

An Examination of Mixed-Mode Debonding in the Blister Test

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Crack opening displacements normal to the plane of an interface crack in a blister specimen are measured using optical interferometry. The displacements are measured up to and including the onset of crack growth and are used to define limits of elastic and inelastic elastic behavior and examine mixed-mode fracture criteria. The extent of inelastic behavior increases with increasing shear component and dominates the onset of crack growth in a bimaterial combination of glass and epoxy.

Author Information

Liechti, KM

The University of Texas at Austin, Austin, TX

Hanson, EC

The University of Texas at Austin, Austin, TX

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Details

Developed by Committee: D14

Pages: 13–27

DOI: 10.1520/STP30324S

ISBN-EB: 978-0-8031-5051-5

ISBN-13: 978-0-8031-0993-3

An Examination of Mixed-Mode Debonding in the Blister Test

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