Chemorheological Characterization of B-Stage Printed Wiring Board Resins

CM Tung; PJ Dynes

doi:10.1520/STP28538S

SYMPOSIA PAPER Published: 01 January 1983

STP28538S

Chemorheological Characterization of B-Stage Printed Wiring Board Resins

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High-performance liquid chromatography (HPLC), gel permeation chromatography (GPC), dynamic mechanical analysis, and differential scanning calorimetry (DSC) have been used to characterize printed wiring board B-stage FR-4 epoxy resins. These techniques demonstrate a capability for fingerprinting the formulations and their thermal and rheological behavior. The relation between gelation and viscoelastic properties has also been examined. The results reveal a new and reproducible method of detecting the onset of gelation. The merit of each technique as a quick quality-control method is evaluated.

Author Information

Tung, CM

Rockwell International Science Center, Thousand Oaks, Calif.

Dynes, PJ

Rockwell International Science Center, Thousand Oaks, Calif.

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Details

Developed by Committee: D30

Pages: 38–53

DOI: 10.1520/STP28538S

ISBN-EB: 978-0-8031-4863-5

ISBN-13: 978-0-8031-0234-7

Chemorheological Characterization of B-Stage Printed Wiring Board Resins

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