Mapping Silicon Wafers by Spreading Resistance

RG Mazur

doi:10.1520/STP25793S

SYMPOSIA PAPER Published: 01 January 1987

STP25793S

Mapping Silicon Wafers by Spreading Resistance

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Whole wafer mapping is a useful method for studying inhomogeneities in as-grown or processed silicon. However, its usefulness has been limited to structures on which four-point-probe measurements can be made. This paper shows that the spreading resistance technique can be used for surface mapping in those situations where four-point-probe measurements are difficult or impossible. The strengths and weaknesses of the two mapping techniques are compared for the following types of samples: P on P⁺ or N on N⁺ epi wafers, low-dose ion implants, ion implants into same conductivity-type substrates, heavily-doped as-grown materials, and very thin films.

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Mazur, RG

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Details

Developed by Committee: F01

Pages: 586–597

DOI: 10.1520/STP25793S

ISBN-EB: 978-0-8031-5021-8

ISBN-13: 978-0-8031-0459-4

Mapping Silicon Wafers by Spreading Resistance

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