Fabrication of Complex Geometries of High-Purity Copper with Superior Thermal Performance

Sarah Synnestvedt; Katherine Harry; Karthik Bodla; Etienne Pelletier; Arslane Bouchemit; Amir Nobari

doi:10.1520/STP163720200122

SYMPOSIA PAPER Published: 26 February 2022

STP163720200122

Fabrication of Complex Geometries of High-Purity Copper with Superior Thermal Performance

Source

This technical paper outlines a digital light processing (DLP) technique that can produce geometrically complex, highly conductive, pure copper parts. By incorporating a high-purity, high-sphericity copper powder into the DLP feedstock and optimizing the DLP printing and sintering process parameters, parts made with this technique achieve electrical conductivities greater than 92% (International Annealed Copper Standard) and negative and positive feature sizes down to 100 µm. As demonstrated by computational fluid dynamics modeling, the resulting copper cold plates exhibit superior thermal performance with an additional 4°C of cooling compared to traditionally manufactured cold plates.

Author Information

Synnestvedt, Sarah

Holo Inc., Newark, CA, US

Harry, Katherine

Holo Inc., Newark, CA, US

Bodla, Karthik

Holo Inc., Newark, CA, US

Pelletier, Etienne

5N Plus Inc., Montreal, Quebec, CA

Bouchemit, Arslane

5N Plus Inc., Montreal, Quebec, CA

Nobari, Amir

5N Plus Inc., Montreal, Quebec, CA

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Details

Pages: 131–151

DOI: 10.1520/STP163720200122

ISBN-EB: 978-0-8031-7722-2

ISBN-13: 978-0-8031-7721-5

Fabrication of Complex Geometries of High-Purity Copper with Superior Thermal Performance

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