Metallic Contamination from Wafer Handling

F Beaudoin; M Meunier; M Simard-Normandin

doi:10.1520/STP15707S

SYMPOSIA PAPER Published: 01 January 1998

STP15707S

Metallic Contamination from Wafer Handling

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The surface photovoltage (SPV) method is used to characterize metallic contamination introduced by wafer handling. It is shown that particles from handling equipment introduce significant levels of metallic contamination. In most cases the correlation between particle contamination and metallic contamination is excellent. We also find that metallic contamination can be introduced during handling in areas where no particles are detected. However, in order to take manufacturing decisions based on surface photovoltage data, one must understand the strengths and limitations of the technique and avoid its pitfalls.

Author Information

Beaudoin, F

GCM, école Polytechnique, Montreal, Quebec, Canada

Simard-Normandin, M

Center for Microanalysis, Nepean, Ontario, Canada

Meunier, M

GCM, école Polytechnique, Montreal, Quebec, Canada

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Details

Developed by Committee: F01

Pages: 219–225

DOI: 10.1520/STP15707S

ISBN-EB: 978-0-8031-5389-9

ISBN-13: 978-0-8031-2489-9

Metallic Contamination from Wafer Handling

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