Lead-free Solders
Editor(s): K. Narayan Prabhu
Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
• Factors affecting the wetting behavior of solders and evolution of interfacial microstructure
• Pb-free high temperature solders for power semiconductor devices
• Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates
• Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
• Microstructural aspects of the ductile-to-brittle transition
• Loading mixity on the interfacial failure mode in lead-free solder joint
• Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths.
• Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint
• Tensile properties of Sn-10Sb-5Cu high temperature lead free solder
• Empirical modeling and rheological characterization of solder pastes used in electronic assemblies
STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.
Table of Contents
Oludele Popoola, Ning Yu, Giles Scuderi
Rolf Miehlke, Robert Geyer, Ulrich Clemens, Birger Thiel
John H. Currier, Emily C. Porter, Michael B. Mayor, John P. Collier, Douglas W. Van Citters
John H. Currier, Michael B. Mayor, John P. Collier, Barbara H. Currier, Douglas W. Van Citters
P. J. Ellison, A. Traynor, B. P. Casey, S. N. Collins
Laurent D. Angibaud, Albert Burstein, William B. Balcom, Gary J. Miller
T. M. Grupp, R. K. Miehlke, M. Hintner, J. Schwiesau, C. Kaddick
Hani Haider, Christian Kaddick