The ability to introduce microcracks by placing multiple microindentations in pre-defined locations in a single crystal substrate opens the possibility for the use of microindentation techniques for electronic device fabrication. It is the objective of this study to demonstrate the possibility of fabricating a superconducting Josephson junction (JJ) by using microindentation cracking techniques. Other potential areas where microindentation techniques can be applied for device fabrication are RF microcircuitry and fiber optics. Once a microindentation is produced, with its associated crack pattern, a means of growing the cracks is required. In this study we present three methods of crack growth, a bending moment method, a thermal stressing method and a crack tip to tip bridging method. Results of these methods applied to single crystal MgO and LaAlO₃ are discussed.