Analysis of Curing Using Simultaneous Dynamic Mechanical and Dielectric Measurements

JH Suwardie

doi:10.1520/STP10705S

SYMPOSIA PAPER Published: 01 January 2001

STP10705S

Analysis of Curing Using Simultaneous Dynamic Mechanical and Dielectric Measurements

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Previously, curing reaction of a thermosetting system, with one of the components being a volatile material, was studied using Simultaneous Thermal Analyzer (STA). The actual heat of curing can be determined by subtracting the heat of volatilization from the heat of the curing process.

A new study of a similar thermosetting system using simultaneous dynamic mechanical and dielectric measurements will compare the onset and completion of the curing reaction between the two measurements. In addition, the new study will also compare between rheological properties such as dynamic loss modulus, G”, and dynamic viscosity, ETA*, and dielectric property such as dynamic loss parameter, ε”.

Author Information

Suwardie, JH

Rheometric Scientific, Inc., Piscataway, NJ, USA

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Details

Developed by Committee: E37

Pages: 131–138

DOI: 10.1520/STP10705S

ISBN-EB: 978-0-8031-5452-0

ISBN-13: 978-0-8031-2887-3

Analysis of Curing Using Simultaneous Dynamic Mechanical and Dielectric Measurements

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