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Compound Semiconductors Contamination Control Metallic Materials, Wire Bonding, and Flip Chip Nuclear and Space Radiation Effects Printed Electronics Sputter Metallization Terminology Test Methods

Compound Semiconductors

F2358-04 Standard Guide for Measuring Characteristics of Sapphire Substrates

F76-08(2016)e1 Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors (Withdrawn 2023)

F1404-92(2007) Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique (Withdrawn 2016)

F418-77(2002) Standard Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements (Withdrawn 2008)

F1212-89(2002) Standard Test Method for Thermal Stability Testing of Gallium Arsenide Wafers (Withdrawn 2008)

F358-83(2002) Standard Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers (Withdrawn 2008)

Contamination Control

F1396-93(2020) Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components (Withdrawn 2023)

F1438-93(2020) Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components (Withdrawn 2023)

F1398-93(2020) Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components (Withdrawn 2023)

F1397-93(2020) Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components (Withdrawn 2023)

F1373-93(2020) Standard Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components (Withdrawn 2023)

F1376-92(2020) Standard Guide for Metallurgical Analysis for Gas Distribution System Components (Withdrawn 2023)

F1375-92(2020) Standard Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components (Withdrawn 2023)

F1374-92(2020) Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components (Withdrawn 2023)

F1394-92(2020) Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves (Withdrawn 2023)

F1372-93(2020) Standard Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components (Withdrawn 2023)

F1094-87(2020) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method (Withdrawn 2023)

F1226-89(1994)e1 Standard Test Method for Calibration of Liquid-Borne Particle Counters for Submicrometer Particle Sizing (Withdrawn 2002)

Metallic Materials, Wire Bonding, and Flip Chip

F1466-20 Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications (Withdrawn 2024)

F375-20 Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)

F44-21 Standard Specification for Metallized Surfaces on Ceramic (Withdrawn 2023)

F19-21 Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals (Withdrawn 2023)

F30-96(2017) Standard Specification for Iron-Nickel Sealing Alloys (Withdrawn 2024)

F1269-13(2018) Standard Test Methods for Destructive Shear Testing of Ball Bonds (Withdrawn 2023)

F85-76(2018) Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes (Withdrawn 2023)

F83-71(2018) Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters (Withdrawn 2023)

F458-13(2018) Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023)

F219-96(2018) Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023)

F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

F459-13(2018) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)

F96-77(2020) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms (Withdrawn 2024)

F180-94(2020) Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices (Withdrawn 2023)

F205-94(2020) Standard Test Method for Measuring Diameter of Fine Wire by Weighing (Withdrawn 2023)

F290-94(2020) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals (Withdrawn 2024)

F256-05(2020) Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium (Withdrawn 2023)

F798-97(2002) Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)

F508-77(2002) Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

F3-02a Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)

F1-03 Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes (Withdrawn 2009)

F979-86(2003) Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)

F357-78(2002) Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)

F78-97(2002) Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)

F816-83(2003) Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)

F4-66(2005) Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)

F692-97(2002) Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)

F97-72(2002)e1 Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008)

F111-96(2002) Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters (Withdrawn 2008)

F1684-06(2021) Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications (Withdrawn 2024)

F7-95(2021) Standard Specification for Aluminum Oxide Powder (Withdrawn 2023)

F31-21 Standard Specification for Nickel-Chromium-Iron Sealing Alloys (Withdrawn 2024)

F15-04(2022) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy (Withdrawn 2024)

F16-12(2022) Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps (Withdrawn 2023)

F18-12(2022) Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices (Withdrawn 2023)

F29-97(2022) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications (Withdrawn 2024)

Nuclear and Space Radiation Effects

F617-00 Standard Test Method for Measuring MOSFET Linear Threshold Voltage (Withdrawn 2006)

F769-00 Standard Test Method for Measuring Transistor and Diode Leakage Currents (Withdrawn 2006)

F773M-16 Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric) (Withdrawn 2023)

F744M-16 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)

F1893-18 Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices (Withdrawn 2023)

F996-11(2018) Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current–Voltage Characteristics (Withdrawn 2023)

F1259M-96(2003) Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric] (Withdrawn 2009)

F616M-96(2003) Standard Test Method for Measuring MOSFET Drain Leakage Current (Metric) (Withdrawn 2009)

F1261M-96(2003) Standard Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line [Metric] (Withdrawn 2009)

F1260M-96(2003) Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009)

F1262M-14 Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric) (Withdrawn 2023)

F676-97(2003) Standard Test Method for Measuring Unsaturated TTL Sink Current (Withdrawn 2009)

F615M-95(2013) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric) (Withdrawn 2022)

F528-99(2005) Standard Test Method of Measurement of Common-Emitter D-C Current Gain of Junction Transistors (Withdrawn 2011)

F466-79(1992) Test Method for Small-Signal Scattering Parameters of Low-Power Transistors in the 0.2 to 2.0 GHZ Frequency Range (Withdrawn 1997)

Printed Electronics

F2073-14 Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch (Withdrawn 2023)

F1996-14 Standard Test Method for Silver Migration for Membrane Switch Circuitry (Withdrawn 2023)

F1596-15 Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity (Withdrawn 2024)

F2360-08(2015)e1 Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source (Withdrawn 2024)

F1661-09(2015) Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch (Withdrawn 2024)

F1842-15 Standard Test Method for Determining Ink or Coating Adhesion on Flexible Substrates for a Membrane Switch or Printed Electronic Device (Withdrawn 2024)

F1812-15 Standard Test Method for Determining the Effect of an ESD Discharge on a Membrane Switch or Printed Electronic Device (Withdrawn 2024)

F1663-15 Standard Test Method for Determining the Capacitance of a Membrane Switch or Printed Electronic Device (Withdrawn 2024)

F3147-15 Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)

F2749-15 Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Printed Electronic Device (Withdrawn 2024)

F1843-15 Standard Practice for Sample Preparation of Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements (Withdrawn 2024)

F2114-02 Standard Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch (Withdrawn 2009)

F1662-16 Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch or Printed Electronic Device (Withdrawn 2023)

F1896-16 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material (Withdrawn 2023)

F2592-16 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch (Withdrawn 2023)

F2771-10(2016) Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions (Withdrawn 2023)

F2750-16 Standard Test Method for Determining the Effects of Bending a Membrane Switch or Printed Electronic Device (Withdrawn 2023)

F3152-16 Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates Using Dry or Wet Abrasive Medium (Withdrawn 2023)

F3291-17 Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor (Withdrawn 2023)

F3290-17 Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)

F2187-02(2019) Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly (Withdrawn 2023)

F2112-02(2019) Standard Terminology for Membrane Switches (Withdrawn 2023)

F2866-11(2019) Standard Test Method for Flammability of a Membrane Switch in Defined Assembly (Withdrawn 2023)

F2359-04(2019) Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source (Withdrawn 2023)

F2188-02(2019) Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly (Withdrawn 2023)

F1762-14 Standard Test Method for Determining the Effects of Atmospheric Pressure Variation on a Membrane Switch (Withdrawn 2023)

F1681-14 Standard Test Method for Determining Current Carrying Capacity of a Membrane Switch Circuit (Withdrawn 2023)

F1683-09 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component (Withdrawn 2018)

F1895-14 Standard Test Method for Submersion of a Membrane Switch (Withdrawn 2023)

F1682-02 Standard Test Method for Determining Travel of a Membrane Switch (Withdrawn 2008)

F1997-07 Standard Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch (Withdrawn 2008)

F1570-01e1 Standard Test Method for Determining the Tactile Ratio of a Membrane Switch (Withdrawn 2007)

F1680-07a(2014) Standard Test Method for Determining Circuit Resistance of a Membrane Switch (Withdrawn 2023)

F2357-10 Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool "RCA" Abrader (Withdrawn 2017)

F1598-95(2014) Standard Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method) (Withdrawn 2023)

F2072-14 Standard Test Method for Hosedown of a Membrane Switch (Withdrawn 2023)

F1597-02 Standard Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch (Withdrawn 2008)

F1689-05(2020) Standard Test Method for Determining the Insulation Resistance of a Membrane Switch (Withdrawn 2023)

F2964-12(2020) Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent Lamp or Other Diffuse Lighting Device (Withdrawn 2023)

F1595-00(2020) Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches (Withdrawn 2023)

F1995-13(2021) Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch (Withdrawn 2023)

F2865-13(2021) Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch (Withdrawn 2023)

Sputter Metallization

F2086-01 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)

F1711-96(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method (Withdrawn 2023)

F1593-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer (Withdrawn 2023)

F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)

F1710-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)

F1845-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)

F1844-97(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage (Withdrawn 2023)

F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)

F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)

F1512-94(2011) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)

F2113-01(2011) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)

F1367-98(2011) Standard Specification for Chromium Sputtering Targets for Thin Film Applications (Withdrawn 2020)

F390-11 Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array (Withdrawn 2020)

F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

F2405-04(2011) Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)

F1761-00(2011) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets (Withdrawn 2020)

F1594-95(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications (Withdrawn 2020)

F1894-98(2011) Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness (Withdrawn 2020)

F1513-99(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)

Terminology

F2576-15a Standard Terminology Relating to Declarable Substances in Materials (Withdrawn 2024)

Test Methods

F2980-13(2017) Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence (XRF)

F2853-10(2023) Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams

F3078-15(2023) Standard Test Method for Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF)

F3139-15(2023) Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry