Journal
Published Online: 16 June 2023
Volume 12, Issue 1
Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate
CODEN: MPCACD
Abstract
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Author Information
Hu, Tianhan
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Li, Zhen
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Wu, Guanzhi
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Li, Shun
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Ding, Kai
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Gao, Yulai
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Shanghai Engineering Research Center for Metal Parts Green Remanufacture, Shanghai University, Shanghai, PR China
Pages: 12
Price: $25.00
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Details
Stock #: MPC20230003
ISSN: 2379-1365
DOI: 10.1520/MPC20230003