Journal Published Online: 05 April 2022
Volume 11, Issue 3

Challenge of Establishing Materials Testing Standards with Miniature Specimen for Solders

CODEN: MPCACD

Abstract

Solder is an essential material for connecting parts inside electrical devices. Although there is an international standard for the chemical composition of solder, there is no testing standard for evaluating the mechanical properties and characteristics of solder as a structural material. The Committee on High Temperature Strength of Materials, the Society of Materials Science, Japan, proposed some testing standards for solders in the early 2000s based on the results from research activities of the Solder Strength Evaluation Method Working Group. The primary objective of the standardization at that time was to acquire stable testing data and to eliminate institutional differences. The recommended specimen diameter is 10 mm. To verify the size difference between the 10-mm-diameter specimen and an actual solder joint inside an electrical device, the working group has been investigating materials testing techniques using a specimen with a reduced diameter of 3 mm. The research results were published in 2020 as Standard for Miniature Testing of Solders. We have also conducted a series of systematic experiments based on the testing standards for Sn-3.0Ag-0.5Cu. The results obtained so far are as follows: In the tensile tests, the tensile strength of the 10-mm- and 3-mm-diameter specimens are almost identical, independent of the specimen size, although the casting method and heat treatment conditions are different. The effect of specimen size on the creep rupture life is insignificant. In the low-cycle fatigue tests, stable fatigue data can be obtained even at high temperatures using the 3-mm-diameter specimen.

Author Information

Hiyoshi, Noritake
Division of Engineering, University of Fukui, Fukui, Japan
Itoh, Takamoto
Department of Mechanical Engineering, Ritsumeikan University, Shiga, Japan
Yamamoto, Takaei
Division of Mechanical Engineering, Oita University, Oita, Japan
Kanayama, Hideyuki
Department of Mechanical Engineering, Ritsumeikan University, Shiga, Japan
Pages: 10
Price: $25.00
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Details
Stock #: MPC20210099
ISSN: 2379-1365
DOI: 10.1520/MPC20210099