Journal
Published Online: 21 February 2017
Volume 6, Issue 1
Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate
CODEN: MPCACD
Abstract
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Author Information
Tikale, Sanjay
Department of Metallurgical & Materials Engineering, National Institute of Technology, Surathkal, Karnataka, IN
Sona, Mrunali
Department of Metallurgical & Materials Engineering, National Institute of Technology, Surathkal, Karnataka, IN
Narayan Prabhu, K.
Department of Metallurgical & Materials Engineering, National Institute of Technology, Surathkal, Karnataka, IN
Pages: 9
Price: $25.00
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Details
Stock #: MPC20160058
ISSN: 2165-3992
DOI: 10.1520/MPC20160058