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Journal Published Online: 28 February 2014
Volume 3, Issue 3

Role of Vapor Pressure on Popcorn Cracking in IC Packages

CODEN: MPCACD

Abstract

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Author Information

Wong, W.
Institute of High Performance Computing, Singapore
Guo, T.
Institute of High Performance Computing, Singapore
Cheng, L.
Department of Mechanical Engineering, Singapore
Pages: 22
Price: $25.00
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Details
Stock #: MPC20130044
ISSN: 2165-3992
DOI: 10.1520/MPC20130044