Journal
Published Online: 14 April 2016
Volume 45, Issue 3
X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification
CODEN: JTEVAB
Abstract
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Author Information
Lin, C.-S.
Dept. of Automatic Control Engineering, Feng Chia Univ. Taichung, TW
Chan, B.-E.
Extended Education on Information and Electrical Engineering, Feng Chia Univ. Taichung, TW
Huang, Y.-C.
Master’s Program of Biomedical Informatics and Biomedical Engineering, Feng Chia Univ., Taichung, TW
Chen, H.-T.
Altek Corp., Taipei, TW
Lin, Y.-C.
Dept. of Automatic Control Engineering, Feng Chia Univ. Taichung, TW
Pages: 11
Price: $25.00
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Details
Stock #: JTE20150015
ISSN: 0090-3973
DOI: 10.1520/JTE20150015