Journal
Published Online: 14 June 2010
Volume 7, Issue 6
Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load
CODEN: JAIOAD
Abstract
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Author Information
Geng, Phil
Intel Corporation, Hillsboro, OR
Pages: 14
Price: $25.00
Reprints and Permissions
Details
Stock #: JAI103044
ISSN: 1546-962X
DOI: 10.1520/JAI103044