Journal
Published Online: 02 September 2010
Volume 7, Issue 9
Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
CODEN: JAIOAD
Abstract
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Author Information
Mallik, S.
Electronic Manufacturing Engineering Research Group, Medway School of Engineering, Univ. of Greenwich at Medway, Kent, United Kingdom
Ekere, N.
Electronic Manufacturing Engineering Research Group, Medway School of Engineering, Univ. of Greenwich at Medway, Kent, United Kingdom
Bhatti, R.
Electronic Manufacturing Engineering Research Group, Medway School of Engineering, Univ. of Greenwich at Medway, Kent, United Kingdom
Pages: 12
Price: $25.00
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Details
Stock #: JAI103043
ISSN: 1546-962X
DOI: 10.1520/JAI103043