Journal
Published Online: 01 November 2010
Volume 8, Issue 1
A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn–Al Base Solder
CODEN: JAIOAD
Abstract
<
Author Information
Takaku, Y.
Dept. of Material Science, Graduate School of Engineering, Tohoku Univ., Sendai, Japan
Ohnuma, I.
Dept. of Material Science, Graduate School of Engineering, Tohoku Univ., Sendai, Japan
Yamada, Y.
Toyota Central R&D Laboratories, Inc., Nagakute-cho, Aichi, Japan
Yagi, Y.
Toyota Central R&D Laboratories, Inc., Nagakute-cho, Aichi, Japan
Nakagawa, I.
Toyota Motor Corporation, Toyota City, Aichi, Japan
Atsumi, T.
Toyota Motor Corporation, Toyota City, Aichi, Japan
Shirai, M.
Toyota Motor Corporation, Toyota City, Aichi, Japan
Ishida, K.
Dept. of Material Science, Graduate School of Engineering, Tohoku Univ., Sendai, Japan
Pages: 18
Price: $25.00
Reprints and Permissions
Details
Stock #: JAI103042
ISSN: 1546-962X
DOI: 10.1520/JAI103042