Cart
Cart
ASTM Logo
Journal Published Online: 14 May 2010
Volume 7, Issue 5

Tensile Properties of Sn-10Sb-5Cu High Temperature Lead Free Solder

CODEN: JAIOAD

Abstract

<

Author Information

Zeng, Qiulian
Zhejiang Province Key Laboratory of Soldering and Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou, China
Guo, Jianjun
Zhejiang Province Key Laboratory of Soldering and Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou, China
Gu, Xiaolong
Zhejiang Province Key Laboratory of Soldering and Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou, China
Zhu, Qingsheng
Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China
Liu, Xiaogang
Zhejiang Province Key Laboratory of Soldering and Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou, China
Pages: 7
Price: $25.00
Related

ASTM License Agreement

Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Details
Stock #: JAI103041
ISSN: 1546-962X
DOI: 10.1520/JAI103041