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Journal Published Online: 03 June 2010
Volume 7, Issue 5

Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

CODEN: JAIOAD

Abstract

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Author Information

Gao, Feng
McCormick School of Engineering and Applied Science, Northwestern Univ., Evanston, IL
Jing, Jianping
The State Key Laboratory of Mechanical System and Vibration, Shanghai JiaoTong Univ., Shanghai, China
Liang, Frank
Intel Corporation, Hillsboro, OR
Williams, Richard
Intel Corporation, Hillsboro, OR
Qu, Jianmin
McCormick School of Engineering and Applied Science, Northwestern Univ., Evanston, IL
Pages: 15
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Stock #: JAI103021
ISSN: 1546-962X
DOI: 10.1520/JAI103021