Journal
Published Online: 29 July 2010
Volume 7, Issue 7
Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive Pastes
CODEN: JAIOAD
Abstract
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Author Information
Durairaj, R.
Dept. of Mechanical and Material Engineering, Faculty of Engineering and Science (FES), Univ. Tunku Abdul Rahman (UTAR), Kuala Lumpur, Malaysia
Man, Lam
Dept. of Mechanical and Material Engineering, Faculty of Engineering and Science (FES), Univ. Tunku Abdul Rahman (UTAR), Kuala Lumpur, Malaysia
Ramesh, S.
Dept. of Mechanical and Material Engineering, Faculty of Engineering and Science (FES), Univ. Tunku Abdul Rahman (UTAR), Kuala Lumpur, Malaysia
Pages: 13
Price: $25.00
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Details
Stock #: JAI103009
ISSN: 1546-962X
DOI: 10.1520/JAI103009