Journal
Published Online: 19 August 2010
Volume 7, Issue 8
Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
CODEN: JAIOAD
Abstract
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Author Information
Wang, Weiqiang
Center for Advanced Life Cycle Engineering (CALCE), Univ. of Maryland, College Park, MD
Osterman, Michael
Center for Advanced Life Cycle Engineering (CALCE), Univ. of Maryland, College Park, MD
Das, Diganta
Center for Advanced Life Cycle Engineering (CALCE), Univ. of Maryland, College Park, MD
Pecht, Michael
Dept. of Electronics Engineering, City Univ. of Hong Kong, Kowloon, Hong Kong SAR
Pages: 11
Price: $25.00
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Details
Stock #: JAI102939
ISSN: 1546-962X
DOI: 10.1520/JAI102939