Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch
Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane SwitchF1995-00R05ASTM|F1995-00R05|en-USStandard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane SwitchStandardF1995 Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch>newBOS Vol. 10.04 Committee F01
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Significance and Use
The different combinations of SMD types, attachment medias, circuit substrates, plating options, and process variation can account for significant variation in test outcome.
The SMD shear strength test is useful to manufacturers and users for determining the bond strength of the component to the membrane switch circuit.
Scope
1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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