Standard Historical Last Updated: Mar 02, 2021 Track Document
ASTM F638-88(1995)e1

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding F0638-88R95E01 ASTM|F0638-88R95E01|en-US Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding Standard new BOS Vol. 10.04 Committee F01
$ 77.00 In stock

Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

Price:
Contact Sales
Related
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Details
Book of Standards Volume: 10.04
Developed by Subcommittee: F01.07
Pages: 3
DOI: 10.1520/F0638-88R95E01