Standard Practice for Spacecraft Hardware Thermal Vacuum Bakeout

1.1 This practice establishes methods for thermal vacuum bakeout of spacecraft and spacecraft components.

1.2 This practice defines the equipment, environment, and certification criteria for each type of bakeout.

1.3 The methods defined in this practice are intended to reduce component outgassing rates to levels necessary to meet mission performance requirements of the contamination sensitive hardware. Times, temperatures, and configurations contained in this document have been found to provide satisfactory results. Experienced operators may find that other, similar times, temperatures and configurations have provided satisfactory results. If deviations from these criteria are deemed appropriate, they should be detailed in the bakeout report.

1.4 This practice describes three bakeout methods: Method A, using prescribed time and pressure criteria; Method B, using prescribed QCM stabilization rate criteria; and Method C, which measures the QCM deposition rate.

1.5 Determination of the acceptable molecular outgassing, selection of the bakeout method, and determination of the specific test completion criteria are the responsibility of the user organization.

1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.