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Last Updated: Dec 19, 2018
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ASTM D2148-13
Standard Test Methods for Bondable Silicone Rubber Tapes Used for Electrical Insulation
Standard Test Methods for Bondable Silicone Rubber Tapes Used for Electrical Insulation
D2148-13
ASTM|D2148-13|en-US
Standard Test Methods for Bondable Silicone Rubber Tapes Used for Electrical Insulation
Standard
D2148 Standard Test Methods for Bondable Silicone Rubber Tapes Used for Electrical Insulation>
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BOS Vol. 10.01 Committee D09
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Significance and Use
4.1 Self-adhesion is a primary initial property since it affects layer-to-layer bonding. The integrity of the bond can significantly affect the electrical and physical performance of the insulation system. Therefore, the degree of self-adhesion is directly related to apparatus performance.
4.2 A high degree of self-adhesion is desirable for most electrical applications. In this test, a short unwinding length indicates a high degree of self-adhesion.
4.3 This test method has been found useful as a quality control test for lot acceptance.
Scope
1.1 These test methods cover tests for bondable silicone rubber tapes which form a sealed structure either with the application of heat (and pressure if needed) or by the process of auto-adhesion (self-fusing).
1.2 The methods appear in the following sections:
| Test Method | Section |
|
|
|
| Adhesion | 3 – 9 |
| Bond Strength | 10 – 17 |
| Dielectric Breakdown Voltage | 18 – 25 |
| Hardness | 40 |
| Length | 32 and 33 |
| Thickness | 26 – 31 |
| Width | 35 – 39 |
1.3 The values stated in inch-pound units are to be regarded as standard, except for °C. The values in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For a specific hazard statement see 22.1.1.