Adhesive bonding operations have been randomly plagued with mechanical and physical (flow, bond line thickness, slick-off, etc.) problems. In an effort to define some of the sources for such problems, we investigated the relationship between environmental (humidity, aging) and cure cycle variations on the adhesive processing characteristics (flow, rheological behavior) as well as mechanical properties. Six adhesives, including some from competitive manufacturing origins, were used for general comparison to ensure that the observed trends were not generic to specific formulations. In this paper, we present a summary of the results.