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Last Updated: Dec 07, 2021
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ASTM B1019-21
Standard Test Method for Determination of Surface Oxides on Copper Rod(for Electrical Purposes)
Standard Test Method for Determination of Surface Oxides on Copper Rod
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Significance and Use
5.1 The copper oxides layer present on the surface of the copper rod has a detrimental effect on both final surface quality of the copper wire produced by cold drawing of the rod, and on the drawing process itself leading to wire breaks and excessive wear of the drawing dies. Thus, it is critical to use adequate cleaning techniques during the copper rod manufacturing process in order to limit the depth of the residual copper oxide layer on the finished rod, and it is necessary to have a method to accurately measure the copper oxide depth.
5.2 This test method is the most common test method used by continuous casting and rolling mills to measure the depth of residual surface oxides after the copper rod has been cleaned.
5.3 Applicability of the test method for any other purpose or product has not been evaluated. Suitability beyond the stated scope shall be evaluated before use.
Scope
1.1 This specification established a quantitative, laboratory conducted, electrolytic reduction method to determine the thickness of surface copper oxide films on copper rod produced to Specification B49 for further fabrication into electrical conductors.
1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.