Standard
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Last Updated: May 28, 2014
Track Document
ASTM B490-09
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
B0490-09
ASTM|B0490-09|en-US
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
Standard
B490 Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits>
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Significance and Use
This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition.
Ductility measurements are of particular value when electroplated parts are to be subjected to moderate stress such as that involved in bolting an electroplated bumper to an automobile or when exposed to a wide range of fluctuating temperatures (thermal shock).
Scope
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.
1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.
1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.
1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.
1.5 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.6 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.